[Text|High-tech LED Yin Mingquan] Recently, Flip-Chip has once again made a small whirlwind in the industry. After overseas companies, mainland packaging companies represented by Hongli Optoelectronics, Getian Optoelectronics, Yimeixinguang, etc. have said that they have successfully developed flip chip devices.
A flip chip device inverts the chip so that the electrodes are soldered directly to the package holder or substrate. Because no gold wire, thermal conductive silver glue and other materials are used, the flip chip device has obvious advantages such as low thermal resistance and high current resistance.
According to the reporter's understanding, there are two main types of flip chip packaging methods used by packaging manufacturers: First, the eutectic method of reflow soldering (hereinafter referred to as "reflow soldering") is added by adding flux (mainly solder paste). The process can be used to some extent with existing die bonding machines, reflow soldering machines, etc., and the cost is slightly lower.
The other is the use of gold-tin alloy eutectic, direct bonding welding method (hereinafter referred to as "alloy welding"), this processing technology needs to purchase professional production equipment such as eutectic welding, the initial input cost is relatively high. According to the person in charge of a packaging company in Shenzhen, the total set of gold-tin eutectic soldering process equipment is about 5 million yuan.
The reflow process is temporarily recognized as having a cost advantage, and it has also been actively involved in research and development by domestic packaging companies. However, the reporter learned that the technology still faces problems such as flux residue, holes and micro-displacement of the chip. Although some companies have indicated that they can improve the yield by cleaning and using better solder paste, but can import them. Large-scale mass production has yet to be upgraded and improved.
The alloy welding process has high reliability due to the use of gold-tin alloy eutectic. Due to the use of precious metal gold, the cost is relatively high, and the reflectivity of the secondary gold is limited, which affects the light-emitting effect.
Recently, Hebei Daqi Optoelectronics Technology Co., Ltd. said that it has developed another flip chip process. The Science and Technology Department of Hebei Province also organized experts to accept the "Joint R&D of LED Flip Chip Adhesive Process Technology" undertaken by Daqi Optoelectronics. By reviewing the project technical data, on-site inspection, questioning and defense procedures, the project was highly evaluated by technical experts and passed the acceptance test.
Li Yaping, chairman of Daqi Optoelectronics, said that the project has been researched and developed with key technologies such as LED chip flip-on adhesive new technology, high-performance heat-dissipating substrate and anisotropic conductive adhesive preparation. LED flip chip bonding new process.
"The COB light source using the LED flip chip adhesive packaging process contains more than 30% of the chips in the same area than the COB light source in the packaged package, and the total luminous flux is increased by more than 50%." Li Yaping said that the adhesive process is the first in China. At present, he has applied for one invention patent and obtained three utility model patents.
The new technology is innovating, and its purpose is to achieve marketization and scale more quickly. Compared with traditional formal packaging, flip chip package is relatively simple in process, but for downstream lighting companies, if you want to quickly accept flip chip products, then in addition to the obvious advantages in technical parameters, the flip chip should be price There is no difference between the formal device and even the price.
However, according to the reporter, the COB light source made by the adhesive process is not cost-effective. “Because there is no large-scale production, the current CR4 light source can achieve 4 yuan/W or so, and it can be reduced by 50% after scale.†Li Yaping said that the COB light source is mainly used in the general lighting market.
Some insiders said that although the adhesive process has the advantages of patents, etc., but who can market the scale of reflow soldering process, alloy welding process and gluing process, it depends on whose product cost-effectiveness can stand the test of the market. .
In the special report of the September issue of "High-LED Products" magazine, the reporter also made a detailed analysis of the reflow soldering process and the alloy soldering process, so stay tuned.
A flip chip device inverts the chip so that the electrodes are soldered directly to the package holder or substrate. Because no gold wire, thermal conductive silver glue and other materials are used, the flip chip device has obvious advantages such as low thermal resistance and high current resistance.
According to the reporter's understanding, there are two main types of flip chip packaging methods used by packaging manufacturers: First, the eutectic method of reflow soldering (hereinafter referred to as "reflow soldering") is added by adding flux (mainly solder paste). The process can be used to some extent with existing die bonding machines, reflow soldering machines, etc., and the cost is slightly lower.
The other is the use of gold-tin alloy eutectic, direct bonding welding method (hereinafter referred to as "alloy welding"), this processing technology needs to purchase professional production equipment such as eutectic welding, the initial input cost is relatively high. According to the person in charge of a packaging company in Shenzhen, the total set of gold-tin eutectic soldering process equipment is about 5 million yuan.
The reflow process is temporarily recognized as having a cost advantage, and it has also been actively involved in research and development by domestic packaging companies. However, the reporter learned that the technology still faces problems such as flux residue, holes and micro-displacement of the chip. Although some companies have indicated that they can improve the yield by cleaning and using better solder paste, but can import them. Large-scale mass production has yet to be upgraded and improved.
The alloy welding process has high reliability due to the use of gold-tin alloy eutectic. Due to the use of precious metal gold, the cost is relatively high, and the reflectivity of the secondary gold is limited, which affects the light-emitting effect.
Recently, Hebei Daqi Optoelectronics Technology Co., Ltd. said that it has developed another flip chip process. The Science and Technology Department of Hebei Province also organized experts to accept the "Joint R&D of LED Flip Chip Adhesive Process Technology" undertaken by Daqi Optoelectronics. By reviewing the project technical data, on-site inspection, questioning and defense procedures, the project was highly evaluated by technical experts and passed the acceptance test.
Li Yaping, chairman of Daqi Optoelectronics, said that the project has been researched and developed with key technologies such as LED chip flip-on adhesive new technology, high-performance heat-dissipating substrate and anisotropic conductive adhesive preparation. LED flip chip bonding new process.
"The COB light source using the LED flip chip adhesive packaging process contains more than 30% of the chips in the same area than the COB light source in the packaged package, and the total luminous flux is increased by more than 50%." Li Yaping said that the adhesive process is the first in China. At present, he has applied for one invention patent and obtained three utility model patents.
The new technology is innovating, and its purpose is to achieve marketization and scale more quickly. Compared with traditional formal packaging, flip chip package is relatively simple in process, but for downstream lighting companies, if you want to quickly accept flip chip products, then in addition to the obvious advantages in technical parameters, the flip chip should be price There is no difference between the formal device and even the price.
However, according to the reporter, the COB light source made by the adhesive process is not cost-effective. “Because there is no large-scale production, the current CR4 light source can achieve 4 yuan/W or so, and it can be reduced by 50% after scale.†Li Yaping said that the COB light source is mainly used in the general lighting market.
Some insiders said that although the adhesive process has the advantages of patents, etc., but who can market the scale of reflow soldering process, alloy welding process and gluing process, it depends on whose product cost-effectiveness can stand the test of the market. .
In the special report of the September issue of "High-LED Products" magazine, the reporter also made a detailed analysis of the reflow soldering process and the alloy soldering process, so stay tuned.
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