Ralink Technology recently issued a press release stating that, according to the latest data from iSippli, a market research organization, the number of global xDSL subscribers grew by approximately 11.7% in 2010, and Ralink's 2010 xDSL shipment growth reached 46%. More than the market average. Accumulatively in 2010, the global xDSL chip market share officially broke 23%. Looking ahead to 2011, Ralink pointed out that according to the current order status, the internal still optimistic about this year's xDSL chip is expected to appear 30 to 40% of the annual shipment growth.
In view of the global broadband market, which is a whirlwind that replaced all dial-up Internet access with full digitization, Ralink took the lead in launching two Integrated Access Devices (IADs) xDSLs that integrate data and audio and video before the (Chung-chi) merger became effective last year. The solution emphasizes the need for a more streamlined 2-layer board design to improve the limitations of 4-layer boards that must be designed for commercially available IAD products. This effectively reduces costs while significantly improving product performance. Ralink Technology has recently acquired a number of xDSL chipsets that have successively received DLNA certifications, enabling PCs and other consumer electronics connected to them to become video and audio centers that support DLNA multimedia streaming.
Wang Bomin, general manager of Broadband Business Division of Ralink Technology, emphasized: “In the market, more and more platform operators are competing with each other for broadband users and triple play end users. For this reason, our customers need more costly structure. With its high-performance products, Ralink has always emphasized product cost, performance and size, and is adept at providing products that meet local needs according to different markets, from launching cost-effective and reliable xDSL entry-level models for emerging countries, to focusing on triple-play convergence. Having developed the national R&D digital set-top box, Ralink is confident that it will extend its product reach to every corner of the global broadband market step by step.â€
In view of the global broadband market, which is a whirlwind that replaced all dial-up Internet access with full digitization, Ralink took the lead in launching two Integrated Access Devices (IADs) xDSLs that integrate data and audio and video before the (Chung-chi) merger became effective last year. The solution emphasizes the need for a more streamlined 2-layer board design to improve the limitations of 4-layer boards that must be designed for commercially available IAD products. This effectively reduces costs while significantly improving product performance. Ralink Technology has recently acquired a number of xDSL chipsets that have successively received DLNA certifications, enabling PCs and other consumer electronics connected to them to become video and audio centers that support DLNA multimedia streaming.
Wang Bomin, general manager of Broadband Business Division of Ralink Technology, emphasized: “In the market, more and more platform operators are competing with each other for broadband users and triple play end users. For this reason, our customers need more costly structure. With its high-performance products, Ralink has always emphasized product cost, performance and size, and is adept at providing products that meet local needs according to different markets, from launching cost-effective and reliable xDSL entry-level models for emerging countries, to focusing on triple-play convergence. Having developed the national R&D digital set-top box, Ralink is confident that it will extend its product reach to every corner of the global broadband market step by step.â€
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