At the China-made Thousand People's Association, Yuan Wenyi, Baidu's IoT Development Director, talked about the changes that need to be made in the intelligent manufacturing environment. He said: "In fact, the Internet problem is basically very mature. Internet-based thinking, we go to the Internet of Things, and then look at smart manufacturing to solve the data problems we face in smart manufacturing." 
The "human-machine method" is the five major factors affecting product quality in the manufacturing industry. Under the reform of intelligent manufacturing, these five factors have also undergone unprecedented changes. At the China-made Thousand People's Association, Yuan Wenyi, Baidu's IoT Development Director, talked about the changes that need to be made in the intelligent manufacturing environment.
Yuan Wenzhao said in his speech: "In fact, the Internet solver's problem has basically been very mature. Based on the Internet-based thinking, we go to the Internet of Things, and then look at smart manufacturing, equal treatment of people and machines, and people and machines as objects. As a dynamic service, we can connect different services in tandem and become a dynamic method. This idea can solve all the problems of our current system information islands and solve the data problems we face in intelligent manufacturing. â€
The following is the full text of Yuan Wenyu's speech:
Today, the main content is mainly two pieces, one is the Internet of Things, and the other is the problem of the man-machine method. Everyone knows that Baidu can't be said to be a traditional enterprise that plays smart manufacturing. Why do you share the relationship between IoT and smart manufacturing at the Smart Manufacturing Society?
First talk about the Internet of Things. The development of the Internet in China to the present era has actually provided us with a good time for the Internet of Things. The scale of China's manufacturing industry also provides this location, so we have reason to believe that smart manufacturing, the biggest development of the Internet of Things should be in China, a little mention, but also according to Moore's Law costs continue to decline.
From the analysis of Bloomberg, we can see that today we are the world of the Internet of Things. Looking at the two latitudes, the first is the quantity scale. Today in the Internet of Things era, we can see that the number of objects is tens of billions. The scale of this market can be seen in the scale of the market is the market size of trillions of dollars. The technology used in such an Internet of Things, or the point of concern to everyone, is different from the original system. In the IOT tens of billions of devices and the tens of billions of scale Internet of Things, they are more focused on data. For the analysis and presentation of big data.
In 2020, the scale of the global Internet of Things will exceed 3 trillion US dollars. The Internet can be said to be a network connecting everyone. Then the Internet of Things is an extension and expansion of the Internet. It not only connects billions of people, but also connects tens of billions of devices or even hundreds of billions of devices. As of 2014, the size of the Chinese Internet of Things market is about 610 billion.
Slightly talk about the status quo of the Internet of Things, whether it is for manufacturing or the Internet of Things, there is such a status quo, that is, complicated and different agreements, but also create an industry gap. Many of the IoT technologies used today are still in the 1980s, so there are still many problems in data analysis and device concurrency. We also find that data is lost because our technology cannot carry such large-scale devices. Therefore, many of our data are also lost in the process of collection or analysis. It also has a lot of regrets for our big data analysis. Many latitude data are found in our analysis process. There should be no data latitude. There should be no data granularity. Now that the manufacturing industry is 2C, there is inevitably a problem of release. The problem of publishing will inevitably make the network and the Internet that we originally made open, in the energy industry, the production industry, and the various industries. Brought a lot of security problems, which became a contradiction. In the end, I am going to get through, or don't get through. If I get through, there may be security problems, but there is no way to directly 2C. This is some of the problems that we have summarized.
Then we have to talk about the cloud, and the cloud came into being. We think it is very appropriate to solve the Internet of Things problem with the cloud. In the past 17 years, the cloud has actually changed the whole world, not just the IT world.
Here you can see the big difference between cloud and traditional deployment. Clouds are everywhere, and there are clouds in places where there are nets. As you can see, the first is that the access to the device can be ubiquitous access. Now that the scale of the tens of billions of Internet of Things, we see expansion and flexibility, then the cloud is born to solve this problem. The infinite expansion of the cloud is first of all elastic and concurrent, elastic computing, and the storage space is also flexible. In other words, the architecture I use to support the Internet of Things, I can actually be flexible. In the early days of my business, it may be a very small cloud. In the future, the same architecture can support an infinitely expanding business system.
SMT basic process components include: screen printing (or dispensing), placement (curing), reflow soldering, cleaning, testing, and repair
1. Silk screen: Its function is to leak solder paste or patch glue onto the PCB pads to prepare for the soldering of components. The equipment used is a screen printing machine (screen printing machine), located at the forefront of the SMT production line.
2. Dispensing: It is to drop the glue onto the fixed position of the PCB board, and its main function is to fix the Electronic Components on the PCB board. The equipment used is a glue dispenser, located at the forefront of the SMT production line or behind the testing equipment.
3. Mounting: Its function is to accurately mount the surface mount components to the fixed position of the PCB. The equipment used is a placement machine, located behind the screen printing machine in the SMT production line.
4. Curing: Its function is to melt the patch glue, so that the surface assembly components and the PCB board are firmly bonded together. The equipment used is a curing oven, located behind the placement machine in the SMT production line.
5. Reflow soldering: Its function is to melt the solder paste, so that the surface assembly components and the PCB board are firmly bonded together. The equipment used is a reflow oven, located behind the placement machine in the SMT production line.
6. Cleaning: Its function is to remove the solder residues such as flux that are harmful to the human body on the assembled PCB board. The equipment used is a washing machine, and the location may not be fixed, it may be online or offline.
7. Inspection: Its function is to inspect the welding quality and assembly quality of the assembled PCB board. The equipment used includes magnifying glass, microscope, online tester (ICT), flying probe tester, automatic optical inspection (AOI), X-RAY inspection system, functional tester, etc. The location can be configured in a suitable place on the production line according to the needs of the inspection.
8. Rework: Its function is to rework the PCB boards that have failed to detect faults. The tools used are soldering irons, rework stations, etc. Configured at any position in the production line.
The advantages of smt chip processing: high assembly density, small size and light weight of electronic products. The volume and weight of chip components are only about 1/10 of that of traditional plug-in components. Generally, after SMT is adopted, the volume of electronic products is reduced by 40%~60 %, the weight is reduced by 60%~80%. High reliability and strong anti-vibration ability. The defect rate of solder joints is low. Good high frequency characteristics. Reduce electromagnetic and radio frequency interference. It is easy to realize automation and improve production efficiency. Reduce costs by 30%~50%. Save materials, energy, equipment, manpower, time, etc. It is precisely because of the complexity of the process flow of smt patch processing that there have been many smt patch processing factories, specializing in smt patch processing. In Shenzhen, thanks to the vigorous development of the electronics industry, smt patch processing achievements The prosperity of an industry.
, Pcbcoming.com focuses on the research and development and production of non-standard customized automation equipment. The company was established in February 2014. The company has a total of more than 300 people and covers an area of 23,000 square meters. The company's annual revenue has exceeded 100 million yuan. Since its establishment, pcbcoming.com has been recognized and supported by customers from 3C consumer electronics, automotive, semiconductor industries, IOT Internet of Things and other industries. The core technologies obtained by pcbcoming.com are multi-axis collaborative control technology, robot-machine interface control technology, high-speed image processing technology, laser precise positioning measurement technology, product assembly and packaging system integration and other core technologies.
Yuan Wenzhao: What is the relationship between the Internet of Things and intelligent manufacturing in the era of big data?
Yuan Wenzhao said in his speech: "In fact, the Internet solver's problem has basically been very mature. Based on the Internet-based thinking, we go to the Internet of Things, and then look at smart manufacturing, equal treatment of people and machines, and people and machines as objects. As a dynamic service, we can connect different services in tandem and become a dynamic method. This idea can solve all the problems of our current system information islands and solve the data problems we face in intelligent manufacturing. â€
The following is the full text of Yuan Wenyu's speech:
Today, the main content is mainly two pieces, one is the Internet of Things, and the other is the problem of the man-machine method. Everyone knows that Baidu can't be said to be a traditional enterprise that plays smart manufacturing. Why do you share the relationship between IoT and smart manufacturing at the Smart Manufacturing Society?
First talk about the Internet of Things. The development of the Internet in China to the present era has actually provided us with a good time for the Internet of Things. The scale of China's manufacturing industry also provides this location, so we have reason to believe that smart manufacturing, the biggest development of the Internet of Things should be in China, a little mention, but also according to Moore's Law costs continue to decline.
From the analysis of Bloomberg, we can see that today we are the world of the Internet of Things. Looking at the two latitudes, the first is the quantity scale. Today in the Internet of Things era, we can see that the number of objects is tens of billions. The scale of this market can be seen in the scale of the market is the market size of trillions of dollars. The technology used in such an Internet of Things, or the point of concern to everyone, is different from the original system. In the IOT tens of billions of devices and the tens of billions of scale Internet of Things, they are more focused on data. For the analysis and presentation of big data.
In 2020, the scale of the global Internet of Things will exceed 3 trillion US dollars. The Internet can be said to be a network connecting everyone. Then the Internet of Things is an extension and expansion of the Internet. It not only connects billions of people, but also connects tens of billions of devices or even hundreds of billions of devices. As of 2014, the size of the Chinese Internet of Things market is about 610 billion.
Slightly talk about the status quo of the Internet of Things, whether it is for manufacturing or the Internet of Things, there is such a status quo, that is, complicated and different agreements, but also create an industry gap. Many of the IoT technologies used today are still in the 1980s, so there are still many problems in data analysis and device concurrency. We also find that data is lost because our technology cannot carry such large-scale devices. Therefore, many of our data are also lost in the process of collection or analysis. It also has a lot of regrets for our big data analysis. Many latitude data are found in our analysis process. There should be no data latitude. There should be no data granularity. Now that the manufacturing industry is 2C, there is inevitably a problem of release. The problem of publishing will inevitably make the network and the Internet that we originally made open, in the energy industry, the production industry, and the various industries. Brought a lot of security problems, which became a contradiction. In the end, I am going to get through, or don't get through. If I get through, there may be security problems, but there is no way to directly 2C. This is some of the problems that we have summarized.
Then we have to talk about the cloud, and the cloud came into being. We think it is very appropriate to solve the Internet of Things problem with the cloud. In the past 17 years, the cloud has actually changed the whole world, not just the IT world.
Here you can see the big difference between cloud and traditional deployment. Clouds are everywhere, and there are clouds in places where there are nets. As you can see, the first is that the access to the device can be ubiquitous access. Now that the scale of the tens of billions of Internet of Things, we see expansion and flexibility, then the cloud is born to solve this problem. The infinite expansion of the cloud is first of all elastic and concurrent, elastic computing, and the storage space is also flexible. In other words, the architecture I use to support the Internet of Things, I can actually be flexible. In the early days of my business, it may be a very small cloud. In the future, the same architecture can support an infinitely expanding business system.
Surface-Mount (SMT) &BGA Assembly
What is SMT PCB assembly?
SMT patch refers to the abbreviation of a series of technological processes that are processed on the basis of PCB, and PCB (Printed Circuit Board) is a printed circuit board. SMT is surface mount technology (Surface Mounted Technology) (abbreviation of Surface Mounted Technology), and it is one of the most popular technologies and processes in the PCB assembly industry.
SMT is surface mount technology (Surface Mounted Technology) (abbreviation of Surface Mounted Technology), and it is one of the most popular technologies and processes in the PCB assembly industry. Electronic circuit surface mount technology (Surface Mount Technology, SMT), called surface mount or surface mount technology. It is a kind of surface assembly components with no leads or short leads (SMC/SMD for short, chip components in Chinese) mounted on the surface of a printed circuit board (Printed Circuit Board, PCB) or the surface of other substrates. Circuit assembly technology in which reflow soldering or dip soldering is used for soldering and assembling. Under normal circumstances, the electronic products we use are designed by PCB plus various capacitors, resistors and other Electronic Components according to the designed circuit diagram, so all kinds of electrical appliances need a variety of smt patch processing techniques to process.
1. Silk screen: Its function is to leak solder paste or patch glue onto the PCB pads to prepare for the soldering of components. The equipment used is a screen printing machine (screen printing machine), located at the forefront of the SMT production line.
2. Dispensing: It is to drop the glue onto the fixed position of the PCB board, and its main function is to fix the Electronic Components on the PCB board. The equipment used is a glue dispenser, located at the forefront of the SMT production line or behind the testing equipment.
3. Mounting: Its function is to accurately mount the surface mount components to the fixed position of the PCB. The equipment used is a placement machine, located behind the screen printing machine in the SMT production line.
4. Curing: Its function is to melt the patch glue, so that the surface assembly components and the PCB board are firmly bonded together. The equipment used is a curing oven, located behind the placement machine in the SMT production line.
5. Reflow soldering: Its function is to melt the solder paste, so that the surface assembly components and the PCB board are firmly bonded together. The equipment used is a reflow oven, located behind the placement machine in the SMT production line.
6. Cleaning: Its function is to remove the solder residues such as flux that are harmful to the human body on the assembled PCB board. The equipment used is a washing machine, and the location may not be fixed, it may be online or offline.
7. Inspection: Its function is to inspect the welding quality and assembly quality of the assembled PCB board. The equipment used includes magnifying glass, microscope, online tester (ICT), flying probe tester, automatic optical inspection (AOI), X-RAY inspection system, functional tester, etc. The location can be configured in a suitable place on the production line according to the needs of the inspection.
8. Rework: Its function is to rework the PCB boards that have failed to detect faults. The tools used are soldering irons, rework stations, etc. Configured at any position in the production line.
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