Action soon Intel new version 6 chip Valentine's Day shipment

Action soon Intel's new 6 Series chip Valentine's Day shipment At the end of last month, Intel announced that due to defects in the LGA1155 interface chipset codenamed Cougar Point, all 6-series chipsets will be temporarily suspended from the date of shipment, and all products that have been sold will be recalled. This event caused great repercussions during the Chinese Lunar New Year. Major motherboard manufacturers, as well as PC and notebook manufacturers, announced their own product recall plan.

At that time, Intel said that it would modify the design of all 6 series chipset products. The revised chipset will be upgraded from B2 to B3 step by step, and will start shipping at the end of February and resume normal production volume in April.

Since this design flaw involves only 4 SATA 3Gbps interfaces of the 6 series chipset, the 2 SATA 6Gbps interfaces are not affected. As a result, earlier this week, Intel announced the restoration of its 6-series chipset offerings to product customers (such as notebooks) that only use SATA 6Gbps interfaces. The revised new chipset has also been put into production and will ship in the middle of this month.

Today's news has been confirmed that Intel announced that the B3 stepping 6-series chipset will begin shipping on Monday, February 14, the western Valentine's Day.

The B3 stepping chipset includes the 6 series of desktops, mobile platforms, and the C200 series for server and workstation platforms. Specific models include Q67, H67, H61, P67, Q65, QM67, HM67, HM65, B65, and UM67. QS67, Z68, C202, C204, and C206. The upgrade instructions are as follows:

- New stepping products have new S-spec and MM# codes.

- Revision ID version number changed from 04h to 05h.

- New stepping chipset requires BIOS update (BIOS specification version 1.1.4).

The -B3 step package is compatible with the B2 pins.

- Minor metal layer changes from step B2 to step B3 can improve the loss of the product life cycle, and there is no change in functionality and design specifications.

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