US military officials said they plan to purchase the outdated Xilinx Virtex-II series of field programmable gate arrays (FPGAs) for data processing of infrared sensors in surveillance, reconnaissance, and fire control systems.
Officials from the US Defense Logistics Agency (DLA) said they plan to purchase 700 to 2800 XC2V2000 Virtex-II FPGAs, which are very important in advanced video processor (AVP) circuit card assemblies (CCA). DLA officials said they plan to provide FPGA for AVP manufacturer Raytheon to develop AVP CCA, which is the main device to replace the second-generation forward-looking infrared (FLIR) B-Kit. The second generation FLIR B-Kit has several components, including AVP CCA, which has been used in multiple systems, such as the advanced long-range reconnaissance monitoring system (LRAS3), M1A3 Abrams tank shooting thermal imaging system, M1A2 Abrams independent thermal Imager, and M3A3 enhanced Bradley acquisition system.
DLA officials said they had a sense of urgency because Xilinx executives said they would discontinue production of XC2V2000 Virtex II FPGAs once orders for this month were completed. In November 2012, Xilinx issued a memorandum stating that the company will stop receiving purchase orders and stop production of Xilinx Virtex-II series FPGA chips, which are essential for designing AVP CCA. Officials of the Army Communications Electronics Command (CECOM) estimated the life cycle of this FPGA-supported system to be 20 years. DLA officials said that without this purchase, the government ’s stock chips would be used up within two years. After completing the demonstration and approval of Virtex-II FPGA procurement, DLA awarded an electronic component distributor An Welfare Company an indefinite number of contracts to provide Virtex-II FPGA with a contract price between US $ 1.4-2.6 million.
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