GLOBALFOUNDRIES and ARM define mobile technology platform innovation standards
At the 2010 World Mobile Communications Conference held recently, GLOBALFOUNDRIES and ARM jointly released new details of their cutting-edge system-on-chip platform technology, which is specifically aimed at next-generation wireless products and applications. The new chip manufacturing platform is expected to increase computing performance by 40%, reduce power consumption by 30%, and increase standby battery life by 100%. This new platform includes two GLOBALFOUNDRIES processes: a 28nm ultra-low power (SLP) process for mobile and consumer applications and a 28nm high-performance (HP) process for applications requiring the highest performance.
GLOBALFOUNDRIES Chief Operating Officer Xie Songhui said: "The success of the next generation of mobile products will increasingly depend on whether it can provide PC-level performance, a highly integrated, rich multimedia experience and longer battery life. This requires a powerful technology Foundation, but also requires close cooperation of industry leaders, so that more design companies have the ability to innovate. We work closely with ARM to jointly optimize the Cortex-A9 processor with our recognized manufacturing experience in mass production of advanced technology products ’S physical IP and implementation provide a fully integrated platform for cutting-edge wireless products and applications.â€
The SoC platform of ARM and GLOBALFOUNDRIES is based on the ARM Cortex-A9 processor, optimized ARM physical IP and GLOBALFOUNDRIES '28nm First-Gate High-K Metal Gate (HKMG) process. ARM and GLOBALFOUNDRIES will work together to help manufacturers of embedded devices such as smartphones, smartbooks, and tablets meet the increasing complexity of design and manufacturing, and at the same time shorten the mass production time in the mature period. GLOBALFOUNDRIES is expected to start manufacturing using these next-generation technologies at Fab 1 in Dresden, Germany in the second half of 2010.
As the market for "smart" mobile products continues to expand, mobile applications are eager for more powerful performance to achieve continuous innovation, and this demand is becoming increasingly prominent. Compared with the previous 40 / 45nm technology, GLOBALFOUNDRIES '28nm process and its Gate-First HKMG technology can provide excellent performance benefits. According to current estimates, 28nm HKMG improves computing performance by approximately 40% in the same temperature envelope (thermal envelope), improves application performance of mobile devices, and enhances multitasking capabilities. GLOBALFOUNDRIES has the ability to quickly bring this technology to market, and the benefits of customers in the widely adopted Gate-First method can now also be obtained in the HKMG process. The Gate-First approach is supported by the broad industry of many of the world ’s largest IDM and fabless design companies.
At the same time, each new generation of technology needs to increase power efficiency to provide longer call / standby, multimedia playback, and interactive game and graphics time. Compared with the 40 / 45nm process, the combination of ARM IP and GLOBALFOUNDRIES 28nm HKMG process can improve the power consumption efficiency by 30% and extend the standby battery life by 100%.
ARM President Tudor Brown said: "The transition to the 28nm technology node will be an important turning point for wireless technology. Our cooperation with GLOBALFOUNDRIES can help customers quickly push high-performance, low-power ARM-based design with 28nm HKMG technology. To the market, and this 28nm HKMG technology has been able to meet the needs of mass production. GLOBALFOUNDRIES technology, leading ARM physical IP solutions and the complete Internet capabilities of the ARM processor, the combination of these three forms a powerful A collection of processing technology, images, and power efficiency. "
GLOBALFOUNDRIES is a leading global foundry with extensive experience in manufacturing high-performance integrated processors using HKMG technology. These experiences will enable customers using the 28-nanometer process to enjoy industry-leading capabilities for rapid mass production.
In addition to its cooperation with GLOBALFOUNDRIES, ARM has also established strategic partnerships with other members of the IBM Joint Development Alliance to promote the process of optimizing processors and physical IP based on the HKMG process. At the just-concluded Mobile World Congress, ARM exhibited the first 28nm wafer using HKMG technology, demonstrating the advantages and achievements it has achieved with its foundry partners in accelerating the next generation of SoCs to more advanced nodes .
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