With the continuous expansion of upstream chip production capacity, the packaging industry has entered the era of low profit, many companies in order to grab customers big price cards, fierce price competition and disorderly industry ecological chain prompted the industry to start demanding new packaging technology. The innovation and application of flip-chip LED chip technology with the advantages of improving luminous efficiency and improving heat dissipation capability is the focus of today's packaging companies.
As the earliest domestic application of flip-chip bonding technology to Jingke Electronics on LED chips, after years of research and development and innovation, it has become a leading brand of high-power high-brightness LED integrated chips for mature flip-chip welding technology in China. In 2013, Jingke Electronics launched a “chip-level LED lighting overall solutionâ€, which can complete some traditional packaging processes or save traditional packaging process in the LED chip manufacturing process. The final package size is reduced and the performance is more stable.
Jingke Electronics said that if it is from the perspective of cost price, flip-chip LED chips are still more expensive than traditional dressing. Although it reduces the process of packaging, the process is more complicated; if the final lm/$ indicator Look, flip-chip LED chip heat dissipation and current distribution are better than traditional dress-up LEDs, which can increase current density and have advantages.
At the same time, Jingke is also the earliest enterprise in China to carry out gold-free wire packaging based on flip-chip welding technology. Among them, chip-level white light high-power LED light source products without gold wire package are at the leading level in the world.
According to Jingke Electronics, Flip-chip has better heat dissipation function than the packaged chip. At the same time, we have epitaxial design, chip process and chip graphic design suitable for flip-chip bonding. The chip products have the advantages of low voltage, high brightness, high reliability, high saturation current density, etc., and the integration of protection circuits on the flip-chip substrate can significantly improve the reliability and performance of the chip; Compared with the vertical structure, the flip-chip bonding method makes it easier to realize ultra-high-power chip-level modules and multi-function integrated chip light source technology, which has great advantages in LED chip module yield and performance. In terms of light efficiency, the flip-chip structure avoids light absorption and electrode shading of the conductive layer on the P electrode, and can also improve the light efficiency by providing a reflective layer on p-GaN.
In the long run, flip-chip will reduce the process of packaging and produce a certain squeeze on the packaging industry. In addition, flipping the chip may result in an increase in the driving power of the chip, which in turn reduces the actual consumption of the chip by the lighting backlight application, and changes the long-term demand for the chip for the lighting application.
At present, Jingke Electronics' products based on the flip-chip process-free gold-line packaging platform involve high-power single crystal devices, COB modules, mobile phone flash lamps, direct-lit backlights, and optical components. Product brand is easy series: Yi Xing (3535), Yi Hui, Yi Xing, Yi Yao. Among them, Yi Xing has been included in the Guangdong Provincial Government procurement catalogue, and the Zhonglong Sichuan Tunnel Project using Yixing products has won 100 honors in global lighting engineering. It has been in business for 3 years since its listing in 2011 and has been updated to the third generation. And in 2013, the product has passed LM80 certification, Guangdong Province standard optical component anion product certification.
The new series of easy-to-open series has created the era of gold-free wire packaging, and the high reliability guarantees the popularization of LED life, and at the same time leads the trend of technological innovation in the LED industry.
However, the development of new technologies is not smooth, and Jingke admits that there are some technical difficulties in the chip manufacturing process and chip packaging process. However, with years of technical accumulation and a high degree of intellectual property protection awareness, Jingke will have one in these two directions. A breakthrough.
Flip-chip LED technology currently has greater advantages in high-power products and integrated packaging. In small and medium-power applications, cost competitiveness is not very strong. Flip-chip technology is very mature in the field of IC, but in the LED exploration stage, this stage requires a lot of R&D investment, and the current strength of the general manufacturers is not enough to support.
Dr. Xiao Guowei, the managing director of Jingke, believes that LED should reduce the cost of the system, improve the technology, master the high-end core technology, and improve the high added value of the product to make the product cost-effective, so that the enterprise can stand firm in the market and achieve long-term development.
As the earliest domestic application of flip-chip bonding technology to Jingke Electronics on LED chips, after years of research and development and innovation, it has become a leading brand of high-power high-brightness LED integrated chips for mature flip-chip welding technology in China. In 2013, Jingke Electronics launched a “chip-level LED lighting overall solutionâ€, which can complete some traditional packaging processes or save traditional packaging process in the LED chip manufacturing process. The final package size is reduced and the performance is more stable.
Jingke Electronics said that if it is from the perspective of cost price, flip-chip LED chips are still more expensive than traditional dressing. Although it reduces the process of packaging, the process is more complicated; if the final lm/$ indicator Look, flip-chip LED chip heat dissipation and current distribution are better than traditional dress-up LEDs, which can increase current density and have advantages.
At the same time, Jingke is also the earliest enterprise in China to carry out gold-free wire packaging based on flip-chip welding technology. Among them, chip-level white light high-power LED light source products without gold wire package are at the leading level in the world.
According to Jingke Electronics, Flip-chip has better heat dissipation function than the packaged chip. At the same time, we have epitaxial design, chip process and chip graphic design suitable for flip-chip bonding. The chip products have the advantages of low voltage, high brightness, high reliability, high saturation current density, etc., and the integration of protection circuits on the flip-chip substrate can significantly improve the reliability and performance of the chip; Compared with the vertical structure, the flip-chip bonding method makes it easier to realize ultra-high-power chip-level modules and multi-function integrated chip light source technology, which has great advantages in LED chip module yield and performance. In terms of light efficiency, the flip-chip structure avoids light absorption and electrode shading of the conductive layer on the P electrode, and can also improve the light efficiency by providing a reflective layer on p-GaN.
In the long run, flip-chip will reduce the process of packaging and produce a certain squeeze on the packaging industry. In addition, flipping the chip may result in an increase in the driving power of the chip, which in turn reduces the actual consumption of the chip by the lighting backlight application, and changes the long-term demand for the chip for the lighting application.
At present, Jingke Electronics' products based on the flip-chip process-free gold-line packaging platform involve high-power single crystal devices, COB modules, mobile phone flash lamps, direct-lit backlights, and optical components. Product brand is easy series: Yi Xing (3535), Yi Hui, Yi Xing, Yi Yao. Among them, Yi Xing has been included in the Guangdong Provincial Government procurement catalogue, and the Zhonglong Sichuan Tunnel Project using Yixing products has won 100 honors in global lighting engineering. It has been in business for 3 years since its listing in 2011 and has been updated to the third generation. And in 2013, the product has passed LM80 certification, Guangdong Province standard optical component anion product certification.
The new series of easy-to-open series has created the era of gold-free wire packaging, and the high reliability guarantees the popularization of LED life, and at the same time leads the trend of technological innovation in the LED industry.
However, the development of new technologies is not smooth, and Jingke admits that there are some technical difficulties in the chip manufacturing process and chip packaging process. However, with years of technical accumulation and a high degree of intellectual property protection awareness, Jingke will have one in these two directions. A breakthrough.
Flip-chip LED technology currently has greater advantages in high-power products and integrated packaging. In small and medium-power applications, cost competitiveness is not very strong. Flip-chip technology is very mature in the field of IC, but in the LED exploration stage, this stage requires a lot of R&D investment, and the current strength of the general manufacturers is not enough to support.
Dr. Xiao Guowei, the managing director of Jingke, believes that LED should reduce the cost of the system, improve the technology, master the high-end core technology, and improve the high added value of the product to make the product cost-effective, so that the enterprise can stand firm in the market and achieve long-term development.
(This article is the electronic submission of Jingke)
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