LED packaging manufacturers have big action without gold wire package into the mainstream

Recently, it is reported that the backlight of Samsung's electronic TV products will be fully flip-chip (Flip Chip) devices, which is undoubtedly a positive answer to some practitioners who still have doubts about flip-chip packaging. And Tang Guoqing, the general manager of Samsung LED China, said with affirmation, "This year's popular gold-free packaging!"

Big factory action

Tang Guoqing said that from a technical point of view, no gold wire packaging has been relatively mature. At present, Samsung LED has seen a huge market prospect of this package form, and has the ability to mass produce 3535B (second generation) of high-power packaged light source device without gold wire.

It is understood that Samsung LED's "no gold wire package" product 3535B can reach 140lm / W (@350mA), the company has plans to terminate the production of gold wire products, go all out to develop gold-free packaging products.

In addition to Samsung's obvious electronic movements, Ronda Electronics also exhibited a "no-bracket" light source device based on the "no gold wire" at this year's Frankfurt exhibition, the so-called "no package" product, the company plans to be in the second Mass production of “no package” products at the end of the quarter. The move is also seen as a move by Taiwanese companies to quickly cut into gold-free products.

Compared with the full deployment of Samsung Electronics, Ronda Electronics said that the "no package" white LED technology is still in its infancy, and the maturity and market acceptance of this product technology will take some time, and will not immediately address SMD. The COB has a huge impact.

In the short term, in addition to actively promoting "no package" white LED products and technologies, Longda Electronics will continue to focus on products with high acceptance in the SMD and COB markets.

However, Longda Electronics believes that in the future, after the products and markets are relatively mature, “no package” products are more competitive than traditional SMD and COB in terms of light efficiency and price. In addition, the “no package” product has the same flexible patching method as SMD. With the investment of more manufacturers, this technology has the opportunity to become the mainstream packaging form in the future.

"From the attitude of well-known foreign manufacturers, it can be seen that 'no gold line packaging' has not yet become the mainstream, but it is already a 'one flower in a hundred flowers,' Tang Guoqing said.

Downstream companies benefit

Regardless of whether the survival status of most mid-stream companies will be squeezed by “no gold line”, downstream application companies will undoubtedly become the beneficiaries of this technology.

Previously, TSMC has partnered with mainland company Topstar Lighting to develop luminaire products using POD (Phosphor on Die) packaged devices.

As a company in the application of lighting, what is the actual experience of this technology? According to the reporter, Liao Guochun, general manager of the LED division of Tongshida, understands that this package does not require reflow soldering at the application terminal. Can be customized according to customer needs.

Product features:
â– Good heat dissipation
--Blade design of copper alloy contacts,good conductivity
â– Super high impact resistance and thermal stability
--Cover pans are made of high quality polycarbonate
â– Chemical corrosion resistance
-- Fingerprint-resistant zinc plated mounting brackets
â– Grounding
  --One-piece grounding design,No Load-Weather resistance

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