CEC Electronics Equipment Group Co., Ltd. (referred to as "Electrical Equipment") recently received a significant milestone. The company's first domestically developed beam ion implanter has achieved over 2 million stable operations on SMIC’s production line, and its first 200mm Chemical Mechanical Polishing (CMP) equipment has successfully entered the market. This marks a major breakthrough under the national science and technology projects known as “02 Special Projects,†where Electrical Equipment is responsible for the development of large-scale integrated circuit manufacturing equipment and full process technologies.
Over the past nine years, Electrical Equipment has been involved in several key projects under the 02 Special Projects, including the research and industrialization of 90-65nm high-angle ion implanters, core components of packaging equipment, 45-22nm low-energy beam ion implantation machines, 28-14nm polishing equipment, and 300mm thin wafer thinning and polishing machines. These efforts have led to technological breakthroughs, with more than 146 invention patents filed and 22 provincial or ministerial-level awards won.
The company has also established a SEMI-compliant ion implanter manufacturing platform, set up a postdoctoral research station, and obtained approval for the “Beijing Chemical Machinery Flattening Process Equipment Engineering Technology Research Center.†It has successfully introduced China’s first ion implanter and 200mm CMP equipment into SMIC’s mass production lines, while advanced packaging equipment now offers comprehensive service capabilities, entering leading domestic packaging companies.
As the core infrastructure of the information age, integrated circuits are vital to national security, economic stability, and defense. However, due to the capital and technology intensity of the industry, China has long faced restrictions in advanced manufacturing equipment, materials, and processes, with high-end chips heavily reliant on imports. To address this, the 02 Special Projects were launched in 2008, focusing on independent innovation in equipment, processes, and materials.
Zhang Boxu, director of the Beijing Economic and Information Commission, emphasized that these projects have filled critical gaps in the industrial chain, strengthened the integration of manufacturing and packaging, and enabled China to compete globally. Major national science and technology projects have created an innovation system for IC manufacturing, driving rapid development in the sector.
Electrical Equipment, a subsidiary of China Electronics Technology Corporation (CETC), was established in 2013 by integrating multiple entities across six provinces and eight parks. Since its founding, it has upheld the spirit of perseverance and dedication, focusing on innovation, military-civilian integration, and serving the country. By overcoming key technologies such as ion implanters and CMP equipment, the company has resolved critical bottlenecks in the development of military electronic components.
With extensive technology accumulation in integrated circuit core equipment and military R&D, Electrical Equipment has developed comprehensive Solutions for semiconductors, high-end displays, photovoltaics, and power battery materials, significantly increasing equipment localization. It is now the leading domestic supplier of integrated circuit, high-end display, photovoltaic, and power battery equipment.
In the field of ion implanters, Electrical Equipment has achieved breakthroughs, obtaining 101 invention patents and two international patents. Its products are now used in SMIC’s 90nm, 55nm, 40nm, and 28nm production lines. As the only domestic supplier of integrated R&D, manufacturing, and service, the company has broken the monopoly of U.S. and Japanese firms, creating a strong domestic brand.
On November 21, the company’s 200mm CMP equipment completed internal tests and was sent to SMIC for online verification, marking the first time a Chinese-made 200mm CMP device enters an IC production line. This breakthrough addresses a critical bottleneck in China’s IC industry.
Under the 02 Special Projects, Electrical Equipment has also developed 200mm CMP equipment independently, breaking foreign technology monopolies. After rigorous testing, the device now performs comparably to international counterparts.
In the advanced packaging sector, over 2,000 units of packaging equipment have been sold and deployed in leading domestic packaging and testing companies. The company has developed flip chip bonders, automatic wafer thinners, and precision scribing machines, reaching advanced domestic and global levels.
Liu Jidong, chairman of the company, emphasized the importance of aligning equipment design with process requirements and continuous process validation. The packaging equipment verification line now serves three key functions: verifying equipment performance, enhancing batch delivery capacity, and building experience for providing full solutions.
As the national team in electronic manufacturing equipment, Electrical Equipment remains committed to developing high-end equipment and supporting national core industries. Looking ahead, the company will focus on key technologies, drive innovation, and expand its industrialization efforts. It aims to build centers like the Beijing IC Equipment Innovation Center and industrial parks in Shanxi and Changsha, while nurturing capabilities in smart manufacturing and system solutions. Ultimately, it seeks to become a leading provider of intelligent manufacturing systems in China.
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