Multi-frequency multi-mode high-pass Gobi LTE chipset evolution analysis

Speaking of network speed, we will naturally mention 4G. As the fastest network technology standard currently in commercial use, 4G is deeply favored by operators and mobile phone manufacturers. The 4G network standard including LTE is just one of the mobile phone networks we have touched every day, including 2G, 3G, etc., and each smartphone needs the support of multiple network bands behind it. In fact, our intelligence Mobile phones can support up to 40 RF bands to meet the diverse needs of the global market. With multi-frequency multi-mode and ready to choose and seamlessly connect to the best and most suitable network technology, all thanks to Modem, Modem has become as important as mobile phone chips, becoming a mobile phone experience. The important factor missing.

Multi-frequency multi-mode high-pass GobiLTE chipset evolution analysis

From the simple call in the 2G era to the emergence of multimedia in the 3G era, whether it is opening a web page, opening a WeChat voice chat or using Weibo to refresh the picture, the mobile phone modem plays a vital role in the back, realizing digital signals and analog signals. Translation and transmission. It satisfies our people's use of smart phones to achieve entertainment, office, travel and other auxiliary needs on the basis of calls, and has been constantly improving themselves in terms of network transmission rate and experience diversity.

The advent of the LTE era has made people's demand for faster network and network-wide support stronger and stronger, and Qualcomm, which has launched the fourth-generation 3G/LTE multi-mode solution in this respect, has the most say. We are all familiar with the Qualcomm Snapdragon series processors, and the Qualcomm Gobi modems are the most powerful processors. Qualcomm first appeared as a leader in the communications field, and then entered the SoC market, and Gobi is the modem chip brand of Qualcomm. It is mainly suitable for mobile terminals, providing 3G/4G-LTE connectivity and complete solutions for our commonly used devices such as smartphones, tablets, ultrabooks, data cards, mobile routers, etc. Currently, Qualcomm Gobi has extended its reach to the reach. Emerging fields such as smart homes and smart cars.

Qualcomm is the first company to introduce the latest 3G/4G multimode modem technology to the market. The Qualcomm Gobi 9X00, the industry's first multi-band multimode LTE modem chipset to be launched in 2008, is now the fourth fastest download speed of 300Mbps. On behalf of the Qualcomm Gobi MDM9X35, the LTE modem in the smartphone has achieved a qualitative leap.

Ubiquitous network needs

Ubiquitous network needs

The Gobi chipset emphasizes high integration and multi-mode multi-frequency support, supporting all 3G and 4G formats on a single chip. In addition to supporting the all-cell mode, the Gobi chipset integrates voice, data, Bluetooth, Wi-Fi, positioning and security functions, making these chips a comprehensive solution for a wide range of applications. In terms of 4G LTE support, the Gobi LTE chipset is leading the world.

The first three generations of 4G, LTE chipset analysis

Gobi's first 4G/LTE chipset MDM9x00 provides the world's first integrated LTE/3G modem, including the MDM9200, MDM9800 and MDM9600 chipsets. The MDM9600 is the world's first LTE/3G multimode modem supporting UMTS, HSPA+, EV. -DO version B, UMB and LTE, launched in 2009. All three MDM9x00 series chipsets will provide full backward compatibility, support FDD and TDD duplex modes and various carrier bandwidths, and support peak downlink rates of up to 50Mbps and peak uplink rates of 25Mbps.

Qualcomm's Gobi second-generation LTE chips include the Gobi MDM9x15 modem, which supports LTE (FDD and TDD), HSPA+, dual-carrier HSPA+, CDMA2000 1xEV-DO Rev. A, Rev. B, and TD-SCDMA. These chipsets are manufactured using 28nm node technology. Compared to the previous generation LTE solution, the MDM9x15 chipset consumes 30% less power and 30% smaller printed circuit board area, making the terminal smaller and thinner. At the same time, this multimode chipset supports a seamless connection between LTE TDD and DC-HSDPA networks, enabling terminals to connect to the highest speed 3G or 4G/LTE networks locally or globally, integrating MDM9x15 SoC includes the Xiaolong S4 MSM8960 and so on. With the MDM9x15 chipset, the role of the mobile broadband router is fully utilized, supporting up to 10 terminals to share 3G/4G networks over Wi-Fi.

In November 2012, Qualcomm partners began sampling the third-generation Qualcomm Gobi LTE chip. The MDM9225 and MDM9625 are the first chips to be equipped with new LTE and HSPA+ modems. They run faster and consume more power than their predecessors. Lower.

Qualcomm third generation 4G LTE modem

Qualcomm third generation 4G LTE modem

The inconsistency of frequency bands is the biggest obstacle to the design of global LTE terminals. At present, there are more than 40 different frequency bands in the world. Multi-mode multi-frequency is an important advantage of Qualcomm's LTE chip. Its products support LTE/3G/2G various cellular communication standards, which effectively promotes the launch of LTE around the world. Qualcomm is also the first to introduce an LTE-A chipset that supports carrier aggregation.

Gobi's third-generation LTE chips include the Gobi MDM9x25 modem, which supports both LTE-enhanced and HSPA+ version 10. The two chipsets combine the industry's only modems that integrate seven different radio access modes into a single baseband chip. Including: CDMA2000, GSM/EDGE, WCDMA, TD-SCDMA, and LTE. This allows OEMs to design a variety of mobile terminals that can be deployed and configured on increasingly diverse radio networks around the world. The MDM9x25 chipset is the first true LTE Category 4 chipset to support LTE carrier aggregation technology with data rates up to 150 Mbps.

Samsung S4 with third-generation 4G platform

Samsung S4 with third-generation 4G platform

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