Basic summary of heat dissipation of electronic components The heat dissipation process of electronic components is mainly completed by three main steps of heat conduction, radiation and convection. First, the heat is conducted from the surface of the chip or component to the heat sink with many blades and good conductors. Then the heat increases radiation on the surface of the heat sink. At the same time, the air takes away a lot of heat through the circulation, so as to achieve The purpose of heat dissipation of electronic components.
There are many factors that affect the heat dissipation of electronic components, such as thermal resistance or power consumption. Thermal resistance is the resistance released by the heat between the air around the radiator and the radiator when the radiator is used for electronic components. The heat loss is called thermal resistance. The presence of the thermal resistance causes the air and the radiator to produce A certain temperature difference, the temperature difference due to the thermal resistance factor will seriously affect the energy loss. With the increase of the thermal resistance value, the greater the temperature difference, the heat dissipation capacity of the radiator gradually weakens, resulting in the work of electronic components The ambient temperature is difficult to reduce, so the thermal resistance is a parameter that cannot be ignored when selecting the radiator. Only when the resistance value of the thermal resistance is met, even in a harsh environment, the radiator can maintain electronic components and external The critical temperature of the environment, that is, the temperature of the housing of the electronic component; with regard to power consumption, the most important heat flow from the heat dissipated by the radiator is the heat of power consumption, some electronic components are not designed reasonably, and most of the electrical energy is converted into thermal energy In turn, the temperature of the components is increased, and the increase in power consumption and heat seriously reduces the service life of electronic components.
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